Fully Self-Aligned Vias

(a) Edge placement error (EPE) in interconnect fabrication. Due to the reduced spacing to the neighboring line, shorts can occur. (b) FSAV scheme based on recess etching. (c) FSAV scheme based on area-selective ALD.
A.J.M. Mackus, M.J.M. Merkx. Fully Self-Aligned Vias: The Killer Application for Area-Selective ALD? – A Discussion of the Requirements for Implementation in High Volume Manufacturing. 2019, 7. AtomicLimits.